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Xianyi Products
Interconnecting Materials for Electronic Packaging
Solder Preforms
List of Common Solders Gold-Based Solders Silver-Based Solders Indium-Based Solders Tin-Based Solders Flux Coated Solder Preforms Packaging Solutions for Automatic Feeding
AuSn Solder Paste
Solder Balls
Solder Wire & Paste
Gold Bonding Wire & Ribbon
Flux
Interconnecting Devices for Electronic Packaging
AuSn Solder Seal Lids
AuSn Thin Film Heat Sinks
Electronic Packaging Materials for Third-Generation Power Semiconductor
AMB Ceramic Substrates
Nano-Ag Paste
Packaging Solutions for Automatic Feeding

Packaging Solutions for Automatic Feeding

XianYi can provide suitable packaging solutions for solder preforms such as boxes, bags, bottles, etc according to different application requirements. In order to match the requirements of automatic feeding, we have deve

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Interconnecting Materials for Electronic Packaging Interconnecting Devices for Electronic Packaging Electronic Packaging Materials for Third-Generation Power Semiconductor
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020-34698382

Email：info@xianyichina.com
Guangzhou Xianyi Electronic Technology Co., Ltd. Address：3/F, Building5& 6, 16 Lianyun 1st heng Road, Shiqi Town, Panyu District, Guangzhou, Guangdong, China