Guangzhou Xianyi Electronic Technology Co., Ltd.
Manufacturer of Advanced Semiconductor Connecting Materials,Providing technical consulting service and solutions
Xianyi Products
Gold Bonding Wire & Ribbon
Bonding wire is an important interconnect material in microelectronic packaging. Because of good corrosion resistance, oxidation resistance and excellent ductility and conductivity, gold wire is widely used in the electr
Features：
Excellent sulfurization resistance
Flexible production with one week delivery
Specifications of Gold Wire
Wire Diam-eter | mil | 0.6 | 0.7 | 0.8 | 0.9 | 1.0 | 1.2 | 1.25 | 1.5 | 1.8 | 2.0 |
μm | 15±1 | 18±1 | 20±1 | 23±1 | 25±1 | 30±1 | 31.8±1 | 38±1 | 45±1 | 50±1 | |
Breaking load(CN) | >2.0 2.0-6.0 | >4.0 4.0-7.0 | >5.0 5.0-8.0 | >7.0 7.0-10.0 | >9.0 9.0-12.0 | >13.0 13.0-16.0 | >15.0 15.0-20.0 | >21.0 21.0-28.0 | >28.0 28.0-37.0 | >32.0 32.0-42.0 | |
Elongation (%) | 1.5-4.0 | 2.0-5.0 | 2.0-7.0 | 2.0-7.0 | 2.0-8.0 | 3.0-8.0 | 3.0-8.0 | 3.0-10.0 | 3.5-11.5 | 4.0-12.0 | |
Fusing Current / A (wire length 10 mm) | 0.28 | 0.31 | 0.38 | 0.45 | 0.49 | 0.62 | 0.71 | 0.83 | 1.01 | - | |
Element Content | Au >99.99% | ||||||||||
(μm) | 90-110 | ||||||||||
Free AirBall Hardness(HV) | 40-45 (1.0 mil) | ||||||||||
Density (g/cm3) | 19.32 | ||||||||||
Resistivity (μΩ·m) | 0.0221 | ||||||||||
Melting Point (℃) | 1064 | ||||||||||
Specifications of Gold Ribbon
Element Content | Au >99.99% |
Density (g/cm3) | 19.32 |
Resistivity (μΩ·m) | 0.0221 |
Melting Point (℃) | 1064 |
Width | 25μm, 50μm, 75μm, 100μm, 150μm, 200μm, etc |
Thickness | 10μm, 12.7μm, 25μm, etc |
* Gold ribbon width and thickness can be customized.
