Guangzhou Xianyi Electronic Technology Co., Ltd.
Manufacturer of Advanced Semiconductor Connecting Materials,Providing technical consulting service and solutions
Xianyi Products
Solder Wire & Paste
A variety of solder wire (min dia 0.1mm) and paste (finest powder T7) are available to meet different demands in electronic assembly.
Solder Paste Specifications
Composition | Melting Temperature/℃ | Powder Specifications of Splder Pis | Package | Delivery | ||
Syringe pack | Can pack | |||||
Lead-free | Bi58Sn42 | 138 | T4~T6 | 10cc 30cc 50cc | 500g | 7-14 working days |
Sn96.5Ag3.0Cu0.5 | 217~218 | |||||
Sn96.5Ag3.5 | 221 | |||||
Sn99Ag0.3Cu0.7 | 217~227 | |||||
Sn99Ag0.5Cu0.5 | 227 | |||||
Sn99.3Cu0.7 | 227 | |||||
Sn99.95 | 232 | |||||
Sn90Sb10 | 240~250 | |||||
Sn95Sb5 | 235~240 | |||||
Lead-containing | Sn62Pb36Ag2 | 179 | ||||
Sn63Pb37 | 183 | |||||
Pb90Sn10 | 275~302 | |||||
Pb92.5Sn5Ag2.5 | 287~296 | |||||
Solder Wire Specifications
Composition | Melting Temperature/℃ | Solder Wire Diameter | Package | Delivery | |
Lead-free | In52Sn48 | 118 | ≥φ0.6mm | 200g 500g 1000g | 7-14 working days |
Bi58Sn42 | 138 | ≥φ0.5mm | |||
Bi575n42Ag1 | 138~140 | ≥φ0.5mm | |||
In97Ag3 | 143 | ≥φ1.0mm | |||
In100 | 157 | ≥φ1.0mm | |||
Sn64Bi35Ag1 | 138~187 | ≥φ0.3mm | |||
Sn96.5Ag3.0Cu0.5 | 217~218 | ≥φ0.10mm | |||
Sn99.3Cu0.7 | 227 | ≥φ0.3mm | |||
Sn90Sb10 | 240~250 | ≥φ0.5mm | |||
Sn95Sb5 | 235~240 | ≥φ0.5mm | |||
Lead-containing | Sn62Pb36Ag2 | 179 | ≥φ0.38mm | ||
Sn63Pb37 | 183 | ≥φ0.38mm | |||
Pb90Sn10 | 275~302 | ≥φ0.5mm | |||
Pb92.5Sn5Ag2.5 | 287~296 | ≥φ0.8mm | |||
*Flux-cored solder wire with a content of indium more than 50% is not available
