Guangzhou Xianyi Electronic Technology Co., Ltd.
Manufacturer of Advanced Semiconductor Connecting Materials,Providing technical consulting service and solutions
Xianyi Products
AuSn Thin Film Heat Sinks
AuSn thin film heat sinks are substrates covered with gold-tin solder layer on the surface, which have been widely used in the optoelectronics industry.
Features
l2~10 μm AuSn solder layer deposited by PVD method
lAlloy film with good solderability
lEnd products and AuSn coating processing services available
lPossessing process capability of thin film circuit manufacturing including lithography, deposition and scribing
Specifications
AuSn Solder Layer | Composition | Au70Sn30, Au75Sn25 |
Thickness & Tolerance | 2~10 μm ± 20% | |
Substrate Material | AlN, Al2O3, WCu, MoCu, quartz, Si, etc. | |
Metallization Layer | Ti/Pt/Au, Ti/Ni/Au, Cu/Ni/Au, Cu/Ni/Pd/Au, etc. *Metallization layer can be customized according to customer requirements. | |
Applications
Optical Component Packaging
High Power Laser Package
