Guangzhou Xianyi Electronic Technology Co., Ltd.
Manufacturer of Advanced Semiconductor Connecting Materials,Providing technical consulting service and solutions
Xianyi Products
Nano-Ag Paste
Nano-Ag paste is compatible with dispensing and printing process and equipment for conventional solder paste. it has low process temperature and high connecting strength, and transforms to100% Ag with high thermal conduc
Features
l Self-developed nano-Ag dispersing system, RoHS compliant
l Pressureless or pressure-assisted sintering
l Low sintering temperature and high working temperature
l High bonding strength, excellent electrical and thermal conductivity
l Alternative to high-lead solder
l No organic residue, cleaning free
Specifications
Type | XY-ASP-N200 | XY-ASP-N250 | XY-ASP-NM250 | XY-ASP-200 | XY-ASP-N250A | |
Surface Demand | Au, Ag | Au, Ag | Au, Ag, , Cu | Au, Ag, Cu, PPF | Au, Ag, Cu | |
Process Temperature and Pressure | 200℃, no pressure | 250℃, no pressure | 250℃, 20MPa | 200℃, no pressure | 250℃, no pressure | |
Atmosphere Demand | Air or N₂ for Au, Ag finishes, N₂ for Cu finish | |||||
After Sintering | Ag content(%) | 100 | 100 | 100 | Semi sintering Resin containing | With resin particles |
Working Temperature (℃) | ＞400 | ＞400 | ＞400 | ＜300 | ＞400 | |
Thermal conductivity (W/m·K) | ＞180 | ＞200 | ＞260 | ＞120 | ＞200 | |
Electrical Conductivity (μΩ·cm) | ＜8.0 | ＜3.0 | ＜1.5 | ＜7.0 | ＜4.0 | |
Bonding Strength (MPa) | ＞30 | ＞30 | ＞60 | ＞10 | ＞30 | |
Package | 2g, 5g, 10g, 20g (syringe pack); 100g, 200g, 500g (jar pack) | |||||
Storage | -30~-15℃, 6 months shelf life | |||||
Applications
High Power Semiconductor Device Packaging
