Guangzhou Xianyi Electronic Technology Co., Ltd.
Manufacturer of Advanced Semiconductor Connecting Materials,Providing technical consulting service and solutions
Xianyi Products
AuSn Solder Seal Lids
The AuSn solder seal lid consists of a lid with a gold-tin solder preform tack-welded on it. The product has been widely used in hermetic packaging of microwave RF modules, FPGA, MEMS devices and optoelectronics.
Features
lSix-sided electroplating, salt spray resistance over 24h
lPrecise tacking
lSmall solder joint, no oxidation or breakdown.
lHigh gas tightness, high corrosion resistance and high reliability
lIndependent production in whole process including lid forming, lid electroplating, solder preform forming and precise tacking
lFast delivery, 6-8 weeks
Composition | Au80Sn20, Au78Sn22 |
Lid Material | 4J29, 4J42, MoCu, Ceramic, etc. |
Lid Finishes | Ni / Au , Ni / Au / Ni / Au Hard/soft gold plating available *Plating structure can be customized according to customer requirements. |
Specifications
