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AMB Ceramic Substrates

Active Metal Brazing (AMB) ceramic substrate usually used as the package substrate for high-voltage power devices and it is specially suitable for the package demand of the third-generation semiconductor SiC devices..

Features

lSelf-developed active brazing material

lWhole process flow self-controlled

lUltra-low interface void, high thermal conductivity

lExcellent temperature shock resistant, high reliability

 

Specifications

Ceramic Specification

Thermal Conductivity (W/m·K)

Si3N4: ≥80

AlN: ≥170

ZAT: ≥27

Thickness (mm)

0.25/0.32

0.25/0.38/0.63/1.0

0.25/0.32/0.38

Copper Specification

Thickness (mm)

0.3/0.4/0.5/0.8

Product Specification

Max Dimension (mm)

138*190

Max Usable Area (mm)

127*178

Product Performance

Void Ratio (C-SAM, 50 um resolution)

<0.3%

Peel Strength (N/mm)

@50 mm/min, copper thickness 0.3mm

>10

Life (cycle)

@-55~150℃, holding 15min, transfer <10s

>5000

>40

>200

Solderability

>95%

Wire Bonding

@300um Al wire, shear speed 500um/s, shear height≤30um

Shear strength≥1000gf

Al residue ≥50%

Ceramic/Copper Thickness Combinations

 

               

                               Copper

                    Thickness/mm

 Ceramic

Thickness/mm

 

0.1-0.3

0.4

0.5

0.8

0.25

Si3N4, ZTA

Si3N4, ZTA

Si3N4, ZTA

Si3N4

0.32

Si3N4, ZTA

Si3N4, ZTA

Si3N4, ZTA

Si3N4

0..38

AlN, Al2O3/ZTA

-

-

-

0.63

AlN, Al2O3

AlN, Al2O3

AlN, Al2O3

-

1.00

AlN, Al2O3

AlN, Al2O3

AlN, Al2O3

AlN, Al2O3

Surface Treatment of AMB Ceramic Substrates

Surface Roughness of Copper

Ra≤1.5μm, Ra≤10μm, Rmax=50μm

Plate

Bare Copper &Anti-oxidation

-

Electroless Ni

2~10μm(P 6%-10%)

Electroless Ag

0.1~1.0μm

Electroless NiAu

Ni: 2~10μm, Au: 0.05~0.3μm

Electroless NiPdAu

Ni: 2~10μm, Pd: 0.05~0.3μm, Au: 0.05~0.3μm

Solder Resist

Line Width, Spacing, Tolerance

≥0.2mm, tolerance ±0.2mm

Position Tolerance

±0.2mm

Thickness

5~40μm

Temperature Resistance

≤320℃/10s

 

Applications

New Energy Vehicle

Rail Traffic

Smart Grid

Photovoltaic and Energy Storage